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분류 :  BGA Sockets
제품명 :  Flip-Top BGA Socket
 
제품정보
Flip-Top™ Sockect Features
  • Designed to save space on new and existing PC boards in test, develop-ment, programming and production applications.
  • No external hold-downs or soldering of BGA device required.
  • AIC exclusive eutectic solder ball terminals offer superior processing.
  • Uses same footprint as BGA device.
  • Compact design maximizes PCB real estate - only3mm wider and 10mm longer than BGA device package.
  • Available with integral, finned heat sink or coin screw clamp assembly.
  • Currently available in 1.27mm pitch.
  • consult factory for additional terminal styles and heat sink options, as well as custom designs.
Specifications
Terminals: Brass; copper Alloy (C36000)
Terminal Support: polyimide Film
Contacts: Beryllium Copper (C17200)
Plating: G - Gold over Nickel
Sprin Material: Stainless Steel
Heat Sink.Coin Screw and support plate
Material: Aluminum
Insulator,Lid and Latch Material:
Molded PPS (High Temp. Glass Filled Thermoplastic),U.L.Rated 94V-O,
-60°C to 260°C (-76°F to 500°F)
Solder Ball:
Eutectic, 63Sn/37Pb,183°C(361°F)


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